industry news
Subscribe Now

DSP Group Introduces ULE for IoT Applications Over Intel(R) Puma(TM) 6-Powered Home Gateways

LOS ALTOS, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) — DSP Group(R), Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, announced today the integration of its ULE-based chipset with home gateways based on Intel’s Puma(TM) 6 SoC. The solution uses DSP Group’s advanced DECT / ULE SoC integrated with the Intel Puma platform.

DSP Group’s cutting-edge ULE solution provides full home coverage on a dedicated interference-free RF spectrum. In addition, the ULE-based solution enables rich voice and visual content to be transferred from nodes to the base and vice versa, providing a unique IoT solution that is un aralleled by other short range RF technology. The ULE solution is easily software-upgradable from standard DECT, which already exists in over than 25 million home gateways. This eliminates the need to add a second OTT (Over-the-Top) box – reducing overall service provider OPEX.

“Extending our mutual work with Intel from standard DECT to ULE-enabled home gateways came as a natural step for both parties,” said Raz Kivelevich-Carmi, VP of Marketing and Business Development at DSP Group. “Reutilizing DSP Group’s DCX81 DECT / ULE solution, SoC and firmware provided a very fast time-to-market reference solution for our joint customers, addressing the need of the ever-changing IoT market,” he concluded.

“DSP Group’s ULE IoT solution enhances the Puma 6 platform beyond HD Voice with the ability to manage security and home automation nodes within the house,” said Bob Ferreira, General Manager, Product and Platform Marketing in Intel’s Service Provider Division. “By remote software upgrade the gateway interacts with IoT platform provider Yoga Systems’ cloud service, allowing users to monitor and control their home from afar,” he continued.

The solution will be presented at the Broadband World Forum and the upcoming European Utility Week at DSP Group’s meeting room.

About DSP Group

DSP Group(R), Inc. (Nasdaq:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear(TM), video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Embedded Storage in Green IoT Applications
Sponsored by Mouser Electronics and Swissbit
In this episode of Chalk Talk, Amelia Dalton and Martin Schreiber from Swissbit explore the unique set of memory requirements that Green IoT designs demand, the roles that endurance, performance and density play in flash memory solutions, and how Swissbit’s SD cards and eMMC technologies can add value to your next IoT design.
Oct 25, 2023
23,788 views