Research and Markets: Global Semiconductor & IC Packaging Materials Market 2014-2019 with BASF, Alent, Hitachi Chemical, Henkel & Kyocera Dominating

DUBLIN--(BUSINESS WIRE)--

Research and Markets (http://www.researchandmarkets.com/research/hzr3lv/semiconductor_and) has announced the addition of the "Semiconductor & IC Packaging Materials Market by Types, Packaging Technologies & Geography - Regional Trends & Forecast to 2019" report to their offering.

The semiconductor and IC packaging materials market had revenue of $21 billion in 2013, with the highest share held by Asia-Pacific accounting for 68%.

The global market is projected to grow at a CAGR of 4.5% from 2014 to 2019. The highest investment is forecasted to be in Asia-Pacific, due to the growing application markets, low cost of production, and availability of raw materials especially in China. ROW is expected to have the highest growth of 3.5% from 2014 to 2019. The North American and European segments are expected to account for 12% and 11.6% of the revenue by 2019, growing at a CAGR of 3.2% and 3.0%, respectively during 2014 to 2019.

BASF SE (Germany), Alent plc (U.K.), Hitachi Chemical Co. Ltd. (Japan), Henkel AG & Company (Germany), and Kyocera Chemical Co. Ltd. (Japan) are the major active players in the semiconductor and IC packaging materials market. These companies showed the highest strategy adoptions amongst other players in the semiconductor and IC packaging materials market and accounted for 55% of the total market activities.

From 2010 to 2014, new product launch was observed as the major growth strategy adopted by the semiconductor and IC packaging materials companies, accounting for a share of 48% overall. In the first half of 2013, Henkel AG & Company (Germany) made four new product launches, followed by two acquisitions by Hitachi Chemical Co. Ltd., and expansions by Hitachi Chemical Co. Ltd. (Japan) and Henkel AG & Company (Germany). Sumitomo Chemical Co. Ltd. (Japan) and Atotech Deutschland Gmbh (Germany) are the other major participants in development activities during this period. The other active players in market development of semiconductor and IC packaging materials are Shinko Electric Industries Co. Ltd. (Japan) and Indium Corporation (U.S.).

Scope

Types

• Organic Substrates
• Bonding Wires
• Lead frames
• Ceramic Packages

Packaging Technologies

• SOP
• GA
• QFN
• DFN
• Others

Key Topics Covered:

1. Introduction
2. Executive Summary
3. Semiconductor & IC Packaging Materials Premium Insights
4. Semiconductor & IC Packaging Materials Market Overview
5. Semiconductor & IC Packaging Materials Market, By Type
6. Semiconductor & IC Packaging Materials Market, By Ppackaging Technology
7. Semiconductor & IC Packaging Materials Market, By Type
8. Semiconductor & IC Packaging Materials Market, Competitive Landscape
9. Company Profiles
10. Appendix

Companies Mentioned

• Alent Plc
• Basf Se
• Henkel Ag & Company
• Hitachi Chemical Co. Ltd.
• Kyocera Chemical Co. Ltd.
• Lg Chemical Ltd.
• Mitsui High-Tec Inc.
• Sumitomo Chemical Co. Ltd.
• Tanaka Holdings Co., Ltd.
• Toray Industries Corporation

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