Kulicke & Soffa Industries, a company specializing in semiconductor and LED assembly equipment, has introduced advanced hub blades called AccuPlus. These blades provide a streamlined solution for discrete wafer dicing with reduced ownership cost and enhanced efficiency.
In the discrete wafer market, wafers are becoming thinner, wherein the overall size of the die continues to be small. Moreover, dicing technologies encounter further difficulties during blade loading and die movement operations, which result in cracks and chipping of the die. These aspects can significantly affect customers’ productivity and efficiency while handling and processing wafers.
According to Nelson Wong, Kulicke & Soffa’s Vice President and Business Unit Executive, the new launch demonstrates the company’s ongoing advancements in research and development that assist customers to enhance their semiconductor production and handling operations and at the same time help in bringing down the associated costs. With optimization of important blade elements such as diamond concentration, diamond grit size and nickel bond hardness, along with new features, the AccuPlus blades provide excellent blade life, superior cut quality, and improved cost of ownership to the discrete wafer dicing market.
Some of the features of the AccuPlus hub blades include tailored solution for small, thin die and backside coated discrete wafers, two series of unique nickel bond hardness, reduced pre-cut process, multi-levels of diamond concentration, and special hub material and design,
Two series of nickel bond hardness are available in the AccuPlus Blades line. They include the Ultra Series’ bond hardness for high loading applications like metalized backside coated and saw street wafers, and the Discrete Series’ bond hardness for high cutting speed to boost production and blade life.
The AccuPlus hub blades come in different diamond concentrations to get the required equilibrium among throughput, loading and blade life. They feature a special hub design and are equipped with stronger materials to reduce noise and blade vibration induced by high spindle speed.
The AccuPlus hub blades will be showcased at the Semicon China show, which will be held from March 20 to 22, 2012 at the Shanghai New International Expo Centre.
Source: http://www.kns.com/