The report provides a market analysis of the data bus market, over the next five years. It contains an analysis of the drivers, challenges, and restraints that affect the industry.
Data Bus Market by Protocol (MIL-STD, AFDX, ARINC 429/629, CAN, TTP), by Application (Military, Commercial Aviation, Automotive), by Component (LRU, Cables, Connectors, IC Assembly), by Geography - Global Forecasts & Analysis to 2020
The data bus market is expected to reach $4.50 billion by 2020, to register a CAGR of 6.07%. The report also focuses on the strategic benchmarking with respect to key players in this market along with revenue hotspots.
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The report contains market analyses of the data bus market for the military, commercial aviation, and the automotive industries. Further, it also provides an analysis of the data bus protocols such as MIL-STD-1553, ARINC 429, ARINC 664/AFDX, CAN protocol, and TTP adopted in the aforementioned industries.
The report also offers a detailed analysis for this market by its major components such as micro-coupler, cables, discrete connectors, and accessory components. A brief illustration on the comparison of automotive and aerospace data bus protocols is also provided.
A competitive landscape comprising of identification of key players and their market share, has also been provided in the report. Strategic profiling of the key players in this market along with a comprehensive analysis of the latest developments, key growth strategies, investments, and core competencies in each segment have been identified.
Key players profiled in the report are TE Connectivity, Rockwell Collins, Fairchild Semiconductor International, Fujikura Ltd, Data Device Corporation, Ballard Technology, Amphenol International, Corning, and Fujikura.
This report segments the data bus market on the basis of protocol, application, component, and region. Further, it contains revenue forecasts and analyses technological trends that are predominant in this market.
The geographical analysis contains an in-depth analysis for the North America, Europe, APAC, the Middle East, and ROW. The analysis is subject to the countries that cover the said market.
The rapid growth of the data bus market has spawned a host of modern solutions and opportunities for automotive systems as well. LIN bus, CAN bus, FlexRay and MOST are also expected to reshape the global market.
Electronic vehicle system networks such as CAN, TTCAN, FlexRay, and LIN have many advantages. Firstly, the cost of implementing the cabling for these networks is lower than traditional approaches.
The needs to reduce the vehicle wiring content and to improve the distribution of control functions within the vehicle have become apparent over the years. Advanced solutions for vehicle networking, especially data bus technologies are expected to witness rapid growth during the forecast period.
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This report provides qualitative and quantitative information on this market. The report identifies the market application gaps, emerging technologies, the need for new product launches, along with high potential geographic regions and countries.
The report provides a granular segmentation of the market, tracks the market size, market share, revenue projections, and financial portfolio thereby, covering a broad spectrum of the market. TE Connectivity, Rockwell Collins, Fairchild Semiconductor International, Fujikura Ltd, Data Device Corporation, Ballard Technology, Amphenol International, Corning, Optical Cable Corporation and Arinc Inc. are projected to be the market leaders and are expected to occupy a significant market share.
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