TestStation Multi-Site in-circuit test system features multiple test head support and concurrent test architecture to reportedly deliver two to four times productivity compared to conventional MDA/ICT systems. Inline automated handler is for high-speed, no-touch printed circuit board assembly test processing; supports panels up to 450 x 350mm, with up to 5,120 test points. Delivers mechanical board transport times of fewer than six sec.

UltraPin II 128HD channel card features 512 hybrid pins per card for high-complexity and high-density applications. Increases pin count to
15,360 pins. High-density channel card doubles system test point counts. Systems configured with 128HD can be configured to 15,360 test points.

LH ICT supports up to 4,096 test points. Multi-Site dual-site model supports two concurrently operating test heads in a footprint under 0.7 m².

Permit moving to automated no-touch manufacturing test. Handler has dual-site support in an 850mm wide footprint; is designed to replace two to four times as many automatic or manual MDA/ICT systems.

Teradyne, www.teradyne.com

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