CMOS Switch Buck DC-DC Converter Fabricated in Organic Interposer with Embedded Zn-Fe Ferrite Core Inductor

K. Hagita; Y. Yazaki; Y. Kondo; M. Sonehara; T. Sato; T. Fujii; K. Kobayashi; S. Nakazawa; H. Shimizu; T. Watanabe; Y. Seino; N. Matsushita; Y. Yanagihara; T. Someya; H. Fuketa; M. Takamiya; T. Sakurai

doi:10.3379/msjmag.1501R002

Power Magnetics

CMOS Switch Buck DC-DC Converter Fabricated in Organic Interposer with Embedded Zn-Fe Ferrite Core Inductor

K. Hagita, Y. Yazaki, Y. Kondo, M. Sonehara, T. Sato, T. Fujii, K. Kobayashi, S. Nakazawa, H. Shimizu, T. Watanabe, Y. Seino, N. Matsushita, Y. Yanagihara, T. Someya, H. Fuketa, M. Takamiya, T. Sakurai

Author information

K. Hagita
Spin Device Technology Center, Faculty of Engineering, Shinshu University
Y. Yazaki
Spin Device Technology Center, Faculty of Engineering, Shinshu University
Y. Kondo
Spin Device Technology Center, Faculty of Engineering, Shinshu University
M. Sonehara
Spin Device Technology Center, Faculty of Engineering, Shinshu University
T. Sato
Spin Device Technology Center, Faculty of Engineering, Shinshu University
T. Fujii
Research & Development Center, SHINKO Electric Industries Co. Ltd.
K. Kobayashi
Research & Development Center, SHINKO Electric Industries Co. Ltd.
S. Nakazawa
Research & Development Center, SHINKO Electric Industries Co. Ltd.
H. Shimizu
Research & Development Center, SHINKO Electric Industries Co. Ltd.
T. Watanabe
Materials & Structures Laboratory, Tokyo Institute of Technology
Y. Seino
Materials & Structures Laboratory, Tokyo Institute of Technology
N. Matsushita
Materials & Structures Laboratory, Tokyo Institute of Technology
Y. Yanagihara
Institute of Industrial Science, University of Tokyo
T. Someya
Institute of Industrial Science, University of Tokyo
H. Fuketa
Institute of Industrial Science, University of Tokyo
M. Takamiya
Institute of Industrial Science, University of Tokyo
T. Sakurai
Institute of Industrial Science, University of Tokyo

Keywords: package-level DC power grid, point of load, buck DC-DC converter, Zn-Fe ferrite, CMOS switch, organic interposer

JOURNAL OPEN ACCESS

2015 Volume 39 Issue 2 Pages 71-79

DOI https://doi.org/10.3379/msjmag.1501R002

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Abstract

To achieve a package-level DC power grid for the next-generation power delivery to LSIs, multiple point-of-load (POL) buck DC-DC converters must be integrated into the package. We developed a 180 nm CMOS switch DC-DC buck converter for the POL DC power supply using a Zn-Fe ferrite core planar inductor embedded in an organic interposer. The embedded inductor had a 25 μm thick copper spiral coil sandwiched by 10 μm thick Zn-Fe ferrite thick film fabricated using the spin-spray method, which exhibited an inductance of 4.6 nH and a Q-factor of 11 at 50 MHz. A 180 nm CMOS switch was mounted using a flip-chip scheme on the organic interposer with the embedded inductor. The developed 50 MHz switching CMOS switch buck DC-DC converter exhibited a power conversion efficiency of about 68% when the input voltage was 2 V, the on-duty ratio was 0.5, the output voltage was 0.855 V, and the current was 1 A.

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