Electronics Weekly Electronics Design & Components Tech News
Caldicot-based Microsemi Semiconductor is now ‘Microchip Technology Caldicot’.
“The organisation is the lead partner in the ZeroAMP Project, an industry-driven initiative funded by the Horizon2020 EU Research and Innovation Program that is focused on developing ultra-low power computing and memory solutions using nanomechanical switches,” according to Microchip.
ZeroAMP’s goal is to build an FPGAs with integrated non-volatile memory that can work from sub-zero temperatures up to 300°C, with no leakage or stand-by power, using micromachined electro-mechanical relays instead of transistors – using a four-terminal relay structure and a moment-driven bistable circular relay.
The intention is to 3D stack the switching elements and use wafer-level processing for hermetic sealing in chip-level packages.
The final technology demonstrators will be a >10,000 relay FPGA with non-volatile re-programmable logic structures plus a 16kbit non-volatile RAM, both at ‘technology readiness level’ 4 (TRL-4).
As well as Microchip Caldicot, the consortium includes:
- X-FAB MEMS Foundry
- AMO (Angewandte Mikro und Optoelektronik) – research foundry nano and opto-electronics with knowledge of carbon-based materials – the proposed relays have carbon-based contacts.
- University of Bristol – system architecture of ZeroAMP demonstrator prototypes and modelling, design and fabrication 3-T, 4-T and non-volatile relays.
- KTH Royal Institute of Technology Sweden – 3D integration and wafer-level packaging
- CSEM (Swiss Centre for Electronics and Microtechnology – functional testing reliability assessment and stress-testing, life-time assessment testing and failure mode analysis.
- SCIPROM – project management, Switzerland
